MC33186DH1 Integrated Circuit Chip NEW & ORIGINAL H-Bridge Driver
electronic integrated circuit
,linear integrated circuits
H-Bridge Driver
The 33186 is a monolithic H-Bridge ideal for fractional horsepower DC-motor and bi-directional thrust solenoid control. The IC incorporates internal control logic, charge pump, gate drive, and low RDS(ON) MOSFET output circuitry. The 33186 is able to control continuous inductive DC load currents up to 5.0 A. Output loads can be pulse width modulated (PWMed) at frequencies up to 10 kHz. This device is powered by SMARTMOS technology.
The 33186 is parametrically specified over a temperature range of -40 C TA 125 C, 5.0 V V+ 28 V. The IC can also be operated up to 40 V with de-rating of the specifications. The IC is available in a surface mount power package with exposed pad for heat sinking.
Features
• Overtemperature, short-circuit protection, and overvoltage protection against transients up to 40 V at VBAT, typical
• RDSON = 150 mΩ for each output transistor at 25 ℃
• Continuous DC load current 5.0 A (TC < 100 ℃)
• Output current limitation at typ 6.5 A +/- 20%
• Short-circuit shutdown for output currents over 8.0 A
• Logic Inputs TTL/CMOS compatible
• Operating frequency up to 20 kHz
• Undervoltage disable function
• Diagnostic output, 2 disable input
• Coding input for alternative functions
• Stable operation with an external capacitance of 47 F minimum at VBAT
H-BRIDGE MOTOR DRIVER
VW SUFFIX (PB-FREE)
98ASH70702A
20-PIN HSOP
MAXIMUM RATINGS
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage to the device.
Ratings | Symbol | Min | Typ | Max | Unit |
ELECTRICAL RATINGS | |||||
Supply Voltage Static Destruction Proof Dynamic Destruction Proof t < 0,5 s |
VBAT VBat |
- 1.0 - 2.0 |
– – |
28 40 |
V |
Logic Inputs (IN1, IN2, DI1, DI2, CODE) | U | -0.5 | – | 7.0 | V |
Output Status - Flag SF | USF | - 0.5 | – | 7.0 | V |
THERMAL RATINGS | |||||
Junction Temperature | TJ | -40 | – | +150 | °C |
Storage Temperature | TS | -55 | – | +125 | °C |
Ambient Temperature | TA | -40 | – | +125 | °C |
Thermal Resistance (with power applied on 2 power MOS) | RthJC | – | – | +1.5 | K/W |
Thermal Resistance (with power applied on 2 power MOS) | RthJC | – | – | +1.5 | K/W |
Peak Package Reflow Temperature During Reflow (1), (2) | TPPRT | Note 2. | °C |
Notes
1. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause malfunction or permanent damage to the device.
2. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.
Figure 1. 33186 Simplified Block Diagram
INTERNAL BLOCK DIAGRAM
Figure 2. 33186 Simplified Internal Block Diagram
PIN CONNECTIONS
Transparent Top View
Metal slug is connected to power ground
Figure 3. 33186 Pin Locations
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